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Tungsten Copper Alloy WCu Base Flange Heat Sink
It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigned by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO),Semiconductors (Si),Metals (Kovar), etc. The products...Read More
Molybdenum Copper Alloy MoCu Base Flange Heat Sink
It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applicationsRead More
CuMo70CuCu CPC Base Flange Heat Sink
Cu/Mo70Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu:Mo-Cu:Cu is 1:4:1. It has different CTE in X and Y direction, higher thermal conductivity than that of W(Mo)-Cu、Cu/Mo/Cu...Read More
Cu Mo Cu CMC Base Flange Heat Sink
Cu/Mo/Cu (CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.Read More

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Electronic Packaging Material

Tungsten Copper Alloy WCu Base Flange Heat Sink

Molybdenum Copper Alloy MoCu Base Flange Heat Sink

CuMo70CuCu CPC Base Flange Heat Sink

Cu Mo Cu CMC Base Flange Heat Sink