Molybdenum-copper alloy base flange heat sink: core component of high-power thermal management

Today, as the power density of electronic equipment continues to rise, the molybdenum-copper alloy (MoCu) base flange heat sink has become a key carrier for solving extreme thermal management problems with its unique material synergy. This composite material integrates the rigid frame of molybdenum with the thermal conductive network of copper, providing a solution that combines thermal stability and efficient heat dissipation for 5G communications, high-energy lasers, aerospace electronics and other fields.
Functional positioning and material breakthrough
The component design of molybdenum-copper alloy directly targets the pain points of thermal management: the molybdenum skeleton maintains structural rigidity at high temperatures, and the copper network constructs a fast heat conduction channel. This heterogeneous composite structure not only overcomes the defect of pure copper softening at high temperatures, but also makes up for the lack of thermal conductivity of pure molybdenum. As the "first contact surface" for heat flow transfer, the base flange has a thermal expansion coefficient that can accurately match the semiconductor chip to avoid performance degradation caused by interface thermal stress.
Structural innovation and process synergy
The manufacturing process of the component shows the deep coupling of materials and mechanics. Through gradient sintering technology, metallurgical bonding of molybdenum and copper interfaces is achieved to eliminate the contact thermal resistance of traditional laminated structures; in the precision machining stage, bionic flow channel design is adopted to dynamically match the heat dissipation path with the heat source distribution. Surface microtexture treatment further enhances the heat transfer efficiency of the contact surface, while the vacuum brazing process ensures the sealing reliability of the components under repeated thermal cycles.

PETROL STEEL CO., LTD Technology Focus
From material formulation to service performance, reconstruct the reliability boundary of thermal management components

Typical applications
• Phased array radar T/R module heat sink
• Electric vehicle IGBT power module heat sink
• Deep space detector radiation-resistant heat dissipation components
• Industrial laser bar packaging thermal management

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