High Thermal Conductivity Diamond

1. High Thermal Conductivity

Through our exclusive grain orientation arrangement process, the thermal conduction path has no obvious breaks. The measured thermal conductivity can reach more than 5 times that of conventional copper materials, significantly improving the heat dissipation efficiency.

2. Low Thermal Expansion

Customized microcrystalline regulating components are added, resulting in a thermal expansion coefficient that is highly compatible with silicon chips. Even after long-term high and low temperature cycling, there will be no interface delamination or cracking.

3. Insulation and Aging Resistance

It is a pure diamond phase structure without residual conductive impurities. It will not experience breakdown or performance degradation even under high voltage and high humidity conditions.

1. Consumer electronics cooling

The heat dissipation sheet for the high-end chips of mobile phones can quickly distribute the heat generated by the full-load operation of the chips throughout the entire device, preventing local overheating and stalling of the device, and extending the service life of the core components of the mobile phone.

2. New energy photovoltaics

Placed at the bottom of the IGBT module of the photovoltaic inverter, it can promptly discharge the concentrated heat generated by the operation of the switching devices, reduce the failure rate of the module during long-term high-temperature operation, and improve the overall power generation stability of the photovoltaic power station.

3. 5G base station equipment

As a heat dissipation transition layer for power amplifier chips, it can quickly remove the heat generated by the high-frequency signal processing, ensuring stable base station signal output and reducing signal connection interruptions caused by overheating.

1. Size customization

We have our own precision cutting equipment, which can process the products to a tolerance accuracy of 0.1mm according to the drawings provided by the customers, without the need for third-party outsourcing processing, and shorten the delivery cycle by more than 30%.

2. Interface processing customization

According to the customer's welding or bonding requirements, a titanium silver alloy transition layer can be plated on the surface of the product to solve the common problem of weak bonding force between ordinary diamonds and metal layers, avoiding the detachment of the coating during use.

3. Performance gradient customization

It can adjust the preparation process parameters according to the different heat dissipation requirements of customers, match the corresponding heat dissipation performance within a reasonable cost range, and avoid customers paying extra fees for redundant performance.

Item	Specification
Product Name	High Thermal Conductivity Diamond
Material Type	Synthetic Diamond / CVD Diamond
Thermal Conductivity	1000–2200 W/m·K (Typical)
Diamond Grade	Electronic Grade / Optical Grade / Heat Spreader Grade
Diamond Structure	Polycrystalline Diamond (PCD) / Single Crystal Diamond (Optional)
Purity	High Purity Diamond (Nitrogen Controlled)
Nitrogen Content	< 5 ppm (Electronic Grade, Custom Available)
Thickness Range	0.1–2.0 mm (Custom Available)
Size Range	Up to 100 × 100 mm (Custom Sizes Available)
Surface Finish	Polished / Double-Side Polished / Lapped
Surface Roughness	Ra ≤ 5 nm (Ultra-Precision Polishing Available)
Density	3.5–3.52 g/cm³
Hardness	90–100 GPa (Mohs Hardness 10)
Thermal Expansion Coefficient	Approximately 1.0–1.2 × 10⁻⁶ /K
Electrical Property	Insulating Material (High Electrical Resistivity)

Q1: Why is High Thermal Conductivity Diamond used for semiconductor thermal management applications?

High Thermal Conductivity Diamond is used in semiconductor thermal management because it provides the highest thermal conductivity among industrial materials, typically reaching 1000–2200 W/m·K. As advanced chips, RF devices, and power electronics generate higher heat densities, traditional materials such as copper and aluminum may not dissipate heat efficiently enough. Diamond heat spreaders can rapidly transfer heat away from hotspots, helping reduce junction temperature, improve device reliability, and extend operating lifetime.

 

Q2: How does High Thermal Conductivity Diamond compare with copper and other heat spreader materials?

High Thermal Conductivity Diamond offers significantly better thermal performance than conventional heat spreader materials. Copper has a thermal conductivity of approximately 400 W/m·K, while high-quality diamond can exceed 2000 W/m·K. In high-power semiconductor, laser, and RF applications where thermal resistance is a critical limitation, diamond provides faster heat spreading, lower thermal stress, and better performance in compact designs where space is limited.

 

Q3: What are the main challenges when purchasing High Thermal Conductivity Diamond materials?

Customers often face challenges including inconsistent thermal conductivity, limited size availability, surface quality issues, and difficulties integrating diamond with semiconductor packages. Poor-quality diamond materials may contain excessive impurities, defects, or uneven thickness, which can reduce thermal performance. Professional suppliers typically provide controlled nitrogen content, customized thickness, precision polishing, and optional metallization coatings to ensure compatibility with different bonding processes.

 

Q4: Can High Thermal Conductivity Diamond be customized for different semiconductor and electronic applications?

Yes. High Thermal Conductivity Diamond can be customized according to application requirements, including size, thickness, surface roughness, coating, and bonding method. For semiconductor heat spreaders, customers may require ultra-flat polished surfaces, specific dimensions, or metallization layers such as Ti/Au, Cr/Au, or W coatings to improve bonding performance with electronic packages.

 

Q5: What industries commonly use High Thermal Conductivity Diamond materials?

High Thermal Conductivity Diamond is widely used in industries requiring advanced heat dissipation solutions, including semiconductor manufacturing, RF and microwave electronics, high-power lasers, LED systems, aerospace electronics, and next-generation power devices. With the increasing demand for AI chips, high-frequency communication systems, and high-power electronic components, diamond thermal management materials are becoming an important solution for overcoming heat dissipation limitations.

 

 

 

 

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