Titanium Parts For Semiconductor

1. Ultra-low impurity release control

We adopt a processing scheme of ceramic tools + iron-free tooling throughout the production process. All auxiliary materials in contact with the workpiece undergo three rounds of acid washing purification, strictly controlling the total content of iron, chromium, etc. to be within 0.02%. This completely avoids the common metal ion contamination problem in semiconductor processes and prevents the formation of excessive metal residues on the wafer surface. It reduces the risk of circuit shorting from the material side.

 

2. Long-term corrosion resistance

After the part is formed, it will undergo two different concentrations of weak oxidizing solution immersion for passivation. A uniform 8-10nm thick titanium dioxide protective film will be generated on the surface. Even when exposed to diluted hydrofluoric acid and nitric acid mixed solutions in the semiconductor cleaning process for 2000 hours continuously, there will be no pitting detachment and no debris scratching the wafer surface.

 

3. High-precision dimensional stability

During processing, the entire process uses liquid nitrogen spray for constant temperature control, controlling the deformation generated during processing within 0.003mm. Before leaving the factory, the finished products undergo 24-hour high and low temperature cycling tests. Even when operating in a semiconductor process environment at 180℃ for a long time, there will be no deformation jamming and no deformation sticking. There is no need to frequently disassemble and adjust the alignment accuracy.

 

4. Low exhaust rate suitable for vacuum environment

All parts are first subjected to 120℃ vacuum baking for 48 hours for degassing treatment. The water vapor and tiny particles adsorbed on the surface are completely removed. After being installed in the semiconductor vacuum chamber, it can help the equipment reach the target vacuum degree 25% faster than using ordinary stainless steel parts, reducing the time loss of waiting for vacuum pumping.

1. Wafer tray for PVD vapor deposition machine

Used to support the silicon wafer to be coated. In the high-temperature environment of target material sputtering, the titanium part will not react with the sputtering gas and will not release excess impurities into the chamber, which can improve the uniformity of the metal film layer deposited on the wafer surface by 5%, avoiding the problem of chip leakage caused by insufficient metal layer thickness. It is suitable for coating production requirements of 28nm and below processes.

 

2. Wafer carrier rack for wet cleaning machine

In the RCA standard cleaning process, the rack is fully immersed in strong acid and strong alkali cleaning solutions. The titanium material will not be corroded and produce debris, and will not adhere to the wafer surface to cause particle contamination. It can reduce the particle defect rate of single batch wafer cleaning by 12%. At the same time, the lightweight characteristic of the rack can also reduce the transmission load of the cleaning machine and lower equipment energy consumption.

 

3. Electrode fixing seat for ion implantation machine

Used to fix the high-voltage electrodes in the machine. The non-magnetic property of titanium will not interfere with the trajectory of the ion beam, allowing the depth deviation of ion implantation to be controlled within a very small range, avoiding the problem of uneven injection dose in the local area of the wafer. It significantly improves the electrical performance consistency of the chip.

 

4. Connector flange for semiconductor vacuum pipeline

Connecting different sections of the vacuum pipeline of the machine. The low exhaust rate of titanium can maintain a high-clean vacuum environment inside the pipeline and will not cause fluctuations in vacuum degree due to the gas release of ordinary stainless steel flanges after long-term use. It reduces the number of machine shutdown alarms triggered by vacuum abnormalities and increases the continuous operation time of the production line by 30%.

1. Customization of non-standard dimensions

Relying on our own 5-axis machining center, the length, width and height of the parts can be adjusted according to the installation space of the customer's existing semiconductor equipment. There is no need for the customer to modify the equipment interface, and the first sample can be delivered within 7 days.

 

2. Customization of surface condition

Two surface treatment methods can be selected as per demand: mirror polishing and matte sandblasting. They are suitable for different cleanliness requirements of the manufacturing process and can avoid particle adhesion that affects the semiconductor production environment.

 

3. Customization of special interfaces

Special structures such as special card slots and positioning holes can be customized to fully match the assembly requirements of the customer's self-developed equipment. No additional adapter components need to be added.

Item	Specification
Product Name	Titanium Parts for Semiconductor
Material	Pure Titanium (Grade 2), Titanium Alloy (Grade 5 Ti-6Al-4V)
Manufacturing Process	CNC Machining, Turning, Milling, Grinding, Welding
Available Shapes	Plate, Ring, Tube, Rod, Block, Custom Parts
Dimensions	Customized according to drawings or samples
Tolerance	Up to ±0.01 mm
Surface Finish	Polished, Sandblasted, Pickled, Anodized, Precision Machined
Surface Roughness	Ra 0.2–1.6 μm (Custom Available)
Purity	Up to 99.6% (Grade 2 Titanium)
Operating Temperature	Up to 400°C
Density	4.51 g/cm³
Hardness	Grade 2: HB 145–200; Grade 5: HRC 30–36
Corrosion Resistance	Excellent resistance to acids, alkalis, and process chemicals
Chemical Compatibility	Suitable for semiconductor chemicals and ultra-high purity environments
Inspection	Dimensional Inspection, Material Certification, Surface Inspection

 

 

 

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