Synthetic Diamond Heat Sink

1. Ultra-high thermal conductivity efficiency

By using a micro-scale diamond particle arrangement and sintering process, the thermal conductivity can be stably maintained at 600-700 W/m·K, which is more than three times higher than that of ordinary aluminum heat sinks. It can evenly distribute the concentrated heat on the device surface within a short period of time, avoiding heat accumulation.

2. Low expansion matching design

By adjusting the composite ratio of diamond and copper, the thermal expansion coefficient of the product is controlled within a range close to that of semiconductor chips. It will not cause interface cracking or detachment problems even during long-term high and low temperature cycling, and its service life is twice longer than that of conventional heat sinks.

3. Lightweight structure

With the same heat dissipation capacity, the overall weight is only 60% of that of pure copper heat sinks. It will not add additional weight to the equipment and is suitable for installation scenarios with strict weight requirements.

1. 5G base station remote radio unit

The RRU equipment of 5G base stations is always in a high-power emission state, and the heat flux density of the power amplifier chip is extremely high. Traditional cooling solutions are difficult to keep the core temperature within the working threshold, which often leads to signal attenuation and disconnection problems. By using China Super Tech Co., Ltd.'s Diamond Heat Sink, the concentrated heat of the power amplifier chip can be quickly conducted out, ensuring the stable operation of the base station for 24 hours in outdoor high-temperature environments, and significantly reducing the frequency of maintenance and inspection.

2. Industrial high-power laser generator

The high-power laser generator used in industrial cutting and welding is extremely sensitive to temperature fluctuations during the operation of the laser diode array. A temperature difference of more than 2℃ will directly affect the output accuracy of the laser, resulting in defective products in the processed parts. Relying on the high uniform heat conduction characteristic of the product, the temperature difference of the working surface of the diode array can be controlled within 1℃, ensuring the stability of laser output and significantly improving the yield rate of precision processing.

3. Aviation airborne radar T/R component

The T/R component of airborne active phased array radar has an extremely high integration degree, and the heat flux density per unit area is far higher than that of conventional electronic devices. At the same time, there are strict requirements for the weight and vibration resistance of the heat dissipation components. This heat dissipation component, with its low expansion and lightweight characteristics, can work stably in complex airborne conditions, avoiding component performance deviation due to thermal deformation and meeting the high reliability usage standards of aviation equipment.

4. New energy vehicle IGBT power module

The IGBT module of the motor controller in new energy vehicles will generate a large amount of heat instantaneously during emergency acceleration and long-term climbing. If the heat dissipation is not timely, it is very likely to trigger the overheating protection of the power device, resulting in the interruption of power output. This heat dissipation component can quickly conduct the peak heat generated by the IGBT, and stabilize the module working temperature within the safe range, improving the reliability and service life of the vehicle power system.

5. Semiconductor manufacturing etching machine power module

The high-frequency power source inside the wafer etching equipment requires a continuous and stable temperature environment to ensure the accuracy of etching lines. A small local temperature deviation will lead to a significant drop in wafer yield. The Diamond Heat Sink of China Super Tech Co., Ltd. can achieve rapid heat distribution, controlling the temperature fluctuation in the core area of the power source within 0.5℃, avoiding etching pattern deviation caused by thermal deformation, and ensuring the processing yield of 12-inch and larger-sized wafers.

6. Medical CT tube heat dissipation component

The tube of the medical CT device will generate a large amount of heat during continuous scanning. Traditional cooling methods require a long waiting time for cooling, which directly affects the efficiency of hospital reception. This heat dissipation component, with its extremely high heat conduction efficiency, can quickly remove the heat generated by the tube during the scanning gap, reducing the equipment cooling waiting time by more than 30%, and ensuring the safe operation of the medical equipment while increasing the number of patients that can be examined per hour.

7. Rail transit traction inverter

The traction inverter of high-speed rail and urban rail transit is always in a vibration and temperature difference span environment. The heat dissipation stability of the internal power module directly affects the reliability of the train's power output. This heat dissipation component, through the integrated sintering process of diamond and metal, has superior anti-shock and anti-vibration performance compared to conventional heat dissipation components, and can work stably in outdoor environments ranging from -20℃ to 60℃, avoiding the power device triggering a reduction in power protection due to overheating, and ensuring the continuity of rail transit operation.

8. Satellite on-board high computing power processing unit

The on-board computing unit of low-orbit satellites can only dissipate heat through radiation in the vacuum environment of space. If the heat generated by the chip cannot be promptly conducted out and accumulates in the narrow cavity, it will directly lead to the failure of the computing chip. The ultra-high thermal conductivity of this heat dissipation component can quickly transfer the heat from the chip to the radiation surface of the satellite shell, maintaining the stable operating temperature of the core components in the space environment without convection and extending the in-orbit service life of the satellite.

‌9. High-end Server AI Accelerator Card‌

When the AI training acceleration card in the data center operates at full load, the heat flux density of a single card is far higher than that of a common CPU. Traditional cooling solutions are prone to local hotspots, resulting in reduced computing power. Using this heat dissipation component can eliminate the local hotspots on the surface of the accelerator card, controlling the temperature difference of the multi-chip cluster within 2°C. Without increasing the power consumption of the cooling system, it can increase the computing power density of a single cabinet in the data center by more than 20%.

China Super Tech Co., Ltd. offers a full-process exclusive customized service. Relying on its own diamond composite sintering production line, without outsourcing processing, it can directly adjust the shape of the heat dissipation components and the proportion of the base material based on the internal space dimensions and power parameters provided by the customer. Samples can be produced within 7 days. It can also cooperate with the customer to perform surface treatments such as nickel plating and gold plating, fully meeting the installation and welding requirements of different devices. This eliminates the intermediate connection process, and the customized cost is 15% lower than the industry average.

Product Name	Synthetic Diamond Heat Sink
Material Type	Synthetic Diamond / CVD Diamond / Diamond-Copper Composite
Diamond Type	Polycrystalline Diamond (PCD) / Single Crystal Diamond (Optional)
Main Composition	Diamond (C) / Diamond-Copper (Cu-Diamond) Composite
Thermal Conductivity	1,000–2,200 W/m·K (Diamond); 500–900 W/m·K (Diamond-Copper Composite, depending on composition)
Coefficient of Thermal Expansion (CTE)	Approx. 1.0–6.0 ppm/K (depending on material structure)
Electrical Property	Electrical Insulator (Diamond); Conductive options available with metal composite structures
Density	Approx. 3.5 g/cm³ (Diamond)
Hardness	8,000–10,000 HV (Diamond)
Operating Temperature	Up to 500°C+ (depending on bonding and application conditions)
Surface Finish	Polished / Lapped / Metallized Surface
Available Shapes	Plate, Sheet, Block, Custom Geometry
Thickness Range	0.1 mm – 5 mm (Customized)
Size Range	Customized according to customer drawings
Metalization Options	Ti/Au, Cr/Au, W, Mo, Cu coating (for bonding improvement)
Bonding Methods	Brazing, Soldering, Diffusion Bonding, Direct Bonding
Thermal Interface Compatibility	Suitable for TIM, solder layers, and semiconductor packaging interfaces

 

 

 

 

 

 

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