Molybdenum Copper Heat Sink

 

The molybdenum-copper (Mo-Cu) heat sink is a metal-based composite material cooling solution specifically designed for high-power electronic devices. It is not a simple metal alloy; instead, it is formed through powder metallurgy, where molybdenum (Mo) and copper (Cu) are microscopically combined to create a unique "molybdenum framework - copper filling" structure. This structure ingeniously combines the low thermal expansion coefficient of molybdenum, the high-temperature stability, and the excellent thermal and electrical conductivity of copper, effectively resolving the contradiction between heat dissipation and thermal stress of high-power chips.

 

 

1.Adjustable thermal expansion coefficient

The most crucial attribute of MoCu Heat Sink, lies in their adjustable thermal expansion coefficient. By changing the ratio of molybdenum and copper, the thermal expansion coefficient (CTE) can be precisely controlled, enabling a good thermal match with ceramic substrates (such as Al₂O₃, BeO) or semiconductor chips (such as Si, GaAs, GaN). The performance of molybdenum-copper heat sinks with different ratios varies. For example, a Mo70Cu heat sink with a molybdenum content of 70 ± 1 wt% has a density of approximately 9.8 g/cm³ and a thermal expansion coefficient of about 9.1 ppm/K, with a thermal conductivity ranging from 170 - 200 W/m·K; a Mo60Cu heat sink with a molybdenum content of 60 ± 1 wt% has a density of approximately 9.66 g/cm³ and a thermal expansion coefficient of about 10.3 ppm/K, with a thermal conductivity ranging from 210 - 250 W/m·K, etc.

 

2.High thermal conductivity

In the molybdenum-copper heat sink, the copper forms a continuous network structure, providing a rapid heat conduction path. Its thermal conductivity is much higher than that of traditional semiconductor materials, enabling the rapid diffusion of heat generated by local hotspots to the entire substrate, effectively improving the heat dissipation efficiency.

 

3.Excellent high-temperature resistance and reliability

The high melting point of molybdenum enables molybdenum copper heat sinks to maintain structural stability and mechanical strength in high-temperature environments, which is crucial for equipment operating under harsh conditions (such as in aerospace). Additionally, its high hardness and wear resistance ensure reliability during packaging and long-term use.

 

4.Significant weight reduction advantage

Compared with tungsten-copper (W-Cu) heat sinks with similar performance, molybdenum-copper heat sinks have a density that is approximately 40% lower. In fields such as aerospace, satellite communication, and microwave packaging where weight sensitivity is a concern, molybdenum-copper heat sinks offer significant advantages, helping to reduce the overall weight of equipment and enhancing equipment performance.

 

 

 

1.High-power semiconductor devices

Molybdenum-copper heat sinks (MoCu heat sinks) are widely used as heat sinks and thermal bases for insulated gate bipolar transistors (IGBTs), high-power LEDs, radio frequency (RF) and microwave power tubes. They can effectively reduce the junction temperature, extend the device lifespan, and ensure the stable operation of high-power semiconductor devices.

 

2.Aerospace and Defense

In the thermal management of systems such as spacecraft electronic equipment, satellite communication antennas, and airborne phased array radars, molybdenum-copper heat sinks play a crucial role. Their lightweight nature, high reliability, and matching thermal expansion characteristics with chips make them indispensable thermal management materials in these fields, ensuring the normal operation of equipment in complex environments.

 

3.Advanced Packaging and Microelectronics

In 3D packaging and system-in-package (SiP), molybdenum-copper heat sinks can serve as package covers, interposers, or chip mounting substrates, providing mechanical support and thermal conduction paths for stacked chips. As the integration density of chips continues to increase, directly fabricating molybdenum-copper heat sinks into micro heat dissipation structures (such as microchannels) has become a cutting-edge research direction.

 

4.Chip-level microchannel cooling

The latest research trend is to use the molybdenum-copper heat sink itself as the main body of the microchannel cooler. Due to its thermal expansion matching with the chip, micro-millimeter-sized channels can be directly machined on the heat sink, allowing the cooling fluid (such as deionized water) to flow over the vicinity of the chip for boiling heat exchange. Experiments have shown that this "chip proximal cooling" design can significantly enhance the cooling efficiency and effectively cope with extreme heat flux densities exceeding 1000 W/cm².

 

 

 

Parameter	Specification / Range
Material Type	Molybdenum Copper Heat Sink
Manufacturing Process	Powder Metallurgy / Copper Infiltration
Composition (Cu Content)	10% – 30% (customizable)
Common Grades	Mo70Cu30 / Mo80Cu20 / Mo90Cu10
Density	9.4 – 9.8 g/cm³
Thermal Conductivity	160 – 220 W/m·K
Coefficient of Thermal Expansion (CTE)	6.5 – 8.5 ×10⁻⁶ /K (25–300°C)
Electrical Conductivity	≥ 30% IACS
Specific Heat	~250 J/kg·K
Operating Temperature	Up to 500°C+
Melting Point	> 2600°C (Mo matrix)
Hardness	150 – 220 HB
Surface Finish	Polished / Ground / Machined
Surface Roughness	Ra 0.8 – 3.2 μm (customizable)
Coating Options	Ni / Au / Ag plating available
Dimensional Tolerance	±0.01 mm (precision machining available)
Available Forms	Plate / Sheet / Block / Flange / Custom Parts
Standard Sizes	Customized per drawing
Joining Methods	Brazing / Soldering / Mechanical fastening
Packaging	Vacuum sealed / Export standard wooden case

 

 

 

 

 

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